1、 Contact the manufacturer
By registering the customer number online, you can choose self-service quotation, order and follow up the production progress.

2、 Cutting
Purpose: according to the requirements of engineering data mi, cut into small pieces to produce plates on large sheets that meet the requirements. Small pieces that meet the requirements of customers
Process: large plate → plate cutting according to MI requirements → curium plate → beer fillet / edge grinding → plate out

3、 Drilling
Purpose: according to the engineering data, drill the required hole diameter at the corresponding position on the plate with the required size
Process: laminated pin → upper plate → drilling → lower plate → inspection / repair

4、 Copper precipitation
Objective: copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method
Process: rough grinding → hanging plate → automatic copper sinking line → lower plate → dipping% dilute H2SO4 → thickening copper

5、 Graphic transfer
Purpose: graphic transfer is to transfer the image on the production film to the board
Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exposure → developing → inspection; (dry film process): Hemp plate → film pressing → standing → alignment → exposure → standing → developing → inspection

6、 Pattern plating
Purpose: pattern electroplating is to electroplate a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the line pattern
Process: upper plate → degreasing → secondary water washing → micro etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate

7、 Film removal
Objective: to remove the anti - electroplating coating with NaOH solution and expose the non - circuit copper layer
Process: water film: inserting rack → alkali leaching → flushing → scrubbing → passing through the machine; Dry film: placing plate → passing machine

8、 Etch
Purpose: etching is to remove the copper layer of non - circuit parts by chemical reaction
etching

9、 Green
Purpose: green oil is to transfer the graphics of green oil film to the board to protect the circuit and prevent tin on the circuit when welding parts
Process: grinding plate → printing photosensitive green oil → curium plate → exposure → developing; Grinding plate → printing the first side → drying plate → printing the second side → drying plate

10、 Character
Purpose: character is a kind of mark that is easy to recognize
Process: after finishing curium with green oil → cooling and standing → screen adjustment → printing characters → rear curium

11、 Gold Plated finger
Objective: a nickel / gold layer with required thickness is plated on the plug finger to make it more hard and wear-resistant
Process: upper plate → degreasing → twice water washing → micro etching → twice water washing → pickling → copper plating → water washing → nickel plating → water washing → gold plating
Tinplate (a parallel process)
Purpose: tin spraying is to spray a layer of lead tin on the exposed copper surface not covered with solder resist oil to protect the copper surface from corrosion and oxidation and ensure good welding performance
Process: Micro etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying

12、 Molding
Objective: to form the shape required by customers through die stamping or NC gong machine. Organic Gong, beer board, hand Gong and hand cutting
Note: the accuracy of data gong machine board and beer board is high, followed by hand Gong, and the hand cutting board can only make some simple shapes

13、 Testing
Objective: to detect the open circuit, short circuit and other defects that affect the functionality through electronic 00% test
Process: upper mold → placing plate → testing → qualified → FQC visual inspection → unqualified → repair → retest → OK → rej → scrapping

14、 Final inspection
Objective: through 00% visual inspection of the appearance defects of the plate, and repair the minor defects to avoid the outflow of the problem and defective plate
Specific work flow: incoming materials → check data → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → treatment → check OK